The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Aug. 28, 2019
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Ji Hoon Oh, Gyeonggi-do, KR;

Dong Hyun Bang, Incheon, KR;

Soo Jin Shin, Gyeonggi-do, KR;

Young Ik Kwon, Taichung, TW;

Tae Kyeong Hwang, Seoul, KR;

Min Jae Lee, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/565 (2013.01); H01L 21/76816 (2013.01); H01L 23/3107 (2013.01); H01L 24/08 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 2224/0237 (2013.01);
Abstract

In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.


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