The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

May. 16, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Wei-Hua Houng, Hsinchu, TW;

Che-Fu Chen, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01); G01N 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67706 (2013.01); G01N 29/04 (2013.01); H01L 21/68707 (2013.01); H01L 22/10 (2013.01);
Abstract

Heights of wafers in a front opening unified pod are identified by using an end effector and a front sensor arranged thereon, such that the end effector can be positioned at the appropriate height when retrieving one of the wafers, so as to avoid colliding with a wafer stored inside the front opening unified pod. Wafer backside properties can also be detected by the end effector, so as to report defects and contaminants on the wafer.


Find Patent Forward Citations

Houng, Wei-Hua. (2021). Robot arm device and method for transferring wafer (U.S. Patent No. 11004713). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11004713

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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