The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Oct. 14, 2014
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Keunhyuk Lee, Jiangsu, CN;
Oseob Jeon, Seoul, KR;
Joon-seo Son, Seoul, KR;
Seungwon Im, Gyeonggi-do, KR;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H05K 3/28 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 21/60 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 25/072 (2013.01); H05K 3/284 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2021/60015 (2013.01); H01L 2021/60277 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H05K 3/4015 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10333 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/49133 (2015.01);
Abstract
Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.