The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jun. 22, 2020
Infineon Technologies Ag, Neubiberg, DE;
Marianna Nomann, Ruethen, DE;
Elmar Kuehle, Warstein, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A power semiconductor module arrangement includes: a base plate; a contact element configured to, when the base plate is arranged in a housing, provide an electrical connection between an inside and an outside of the housing; an electrically insulating first layer connected to the base plate, the contact element being connected to the electrically insulating first layer; a third layer on the base plate or on the electrically insulating first layer; and a second layer on the electrically insulating first layer or on the contact element. The electrically insulating first layer is mounted on the base plate such that the third layer attaches the electrically insulating first layer to the base plate. The contact element is mounted on the electrically insulating first layer such that the second layer attaches the contact element to the electrically insulating first layer.