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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11004679 B1

PDFFull Text
Date of Patent:
May. 11, 2021

Filed:

Jan. 31, 2018

Method and system for supplying chemical liquid in semiconductor fabrication

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Wu-Hsing Huang, Hsinchu County, TW;

Chia-Hung Kao, Budai Township, Chiayi County, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Kirsten Jolley

Int. Cl.
CPC ...
B05D 3/12 (2006.01); H01L 21/02 (2006.01); G03F 7/09 (2006.01); G03F 7/004 (2006.01); G03F 7/095 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 21/68 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); G03F 7/16 (2006.01); H01L 21/8238 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02282 (2013.01); B05D 1/005 (2013.01); G03F 7/0045 (2013.01); G03F 7/091 (2013.01); G03F 7/092 (2013.01); G03F 7/095 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02532 (2013.01); H01L 21/30604 (2013.01); H01L 21/6715 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67748 (2013.01); H01L 21/681 (2013.01); H01L 21/762 (2013.01); H01L 21/823821 (2013.01); H01L 29/6681 (2013.01); H01L 29/7853 (2013.01);
Abstract

A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.

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