The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jun. 18, 2020
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Tomoyuki Shimodaira, Nagano, JP;
Hitoshi Kondo, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO, LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); B81C 1/00 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
C23F 1/00 (2013.01); B81C 1/00539 (2013.01); H01L 21/32134 (2013.01); H05K 3/002 (2013.01); H05K 3/4644 (2013.01);
Abstract
A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.