The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Aug. 06, 2019
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Te Connectivity Corporation, Berwyn, PA (US);
Measurement Specialties (Chengdu) Ltd., Chengdu, CN;
Shenzhen Ami Technology Co. Ltd., Shenzhen, CN;
Fengchun Xie, Shanghai, CN;
Dandan Zhang, Shanghai, CN;
Roberto Francisco-Yi Lu, Bellevue, WA (US);
Lvhai Hu, Shanghai, CN;
Qinglong Zeng, Shenzhen, CN;
Lan Gong, Chengdu, CN;
Qian Ying, Chengdu, CN;
Yingcong Deng, Shanghai, CN;
Yun Liu, Shanghai, CN;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
TE Connectivity Corporation, Berwyn, PA (US);
Measurement Specialties (Chengdu) Ltd., Chengdu, CN;
Shenzhen AMI Technology Co. Ltd., Shenzhen, CN;
Abstract
An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.