The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Dec. 11, 2019
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Gaspard Hiblot, Leuven, BE;

Sylvain Baudot, Woluwe Saint-Pierre, BE;

Geert Van der Plas, Leuven, BE;

Assignee:

IMEC vzw, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/45 (2006.01); H01L 21/762 (2006.01); H01L 27/088 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 29/456 (2013.01); H01L 21/76224 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01); H01L 29/0847 (2013.01); H01L 29/41791 (2013.01); H01L 29/665 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 21/02129 (2013.01); H01L 21/31111 (2013.01);
Abstract

The disclosed technology relates generally to integrated circuit structures, and more particularly to a semiconductor fin structure having silicided portions. In an aspect, a semiconductor device including a fin structure and a substrate is disclosed. The fin structure includes a first source/drain region, a second source/drain region, and a channel region. The channel region is arranged between the first source/drain region and the second source/drain region to separate the first source/drain region and the second source/drain region in a length direction of the fin structure. The first source/drain region includes a bottom portion and a top portion, wherein the bottom portion of the first source/drain region is fully silicided and the top portion of the first source/drain region is partly silicided.


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