The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Dec. 17, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Paul A. Zimmerman, Phoenix, AZ (US);

Ian A. Young, Portland, OR (US);

Wilman Tsai, Saratoga, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/05 (2006.01); H01L 29/16 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/06 (2006.01); C01B 32/182 (2017.01); H01L 29/739 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1606 (2013.01); C01B 32/182 (2017.08); H01L 29/0665 (2013.01); H01L 29/41725 (2013.01); H01L 29/66045 (2013.01); H01L 29/66356 (2013.01); H01L 29/7391 (2013.01); H01L 29/778 (2013.01); H01L 51/0595 (2013.01); C01B 2204/22 (2013.01); H01L 23/53276 (2013.01);
Abstract

Molecular Graphene (MG) of a physical size and bonding character that render the molecule suitable as a channel material in an electronic device, such as a tunnel field effect transistor (TFET). The molecular graphene may be a large polycyclic aromatic hydrocarbon (PAH) employed as a discrete element, or as a repeat unit, within an active or passive electronic device. In some embodiments, a functionalized PAH is disposed over a substrate surface and extending between a plurality of through-substrate vias. Heterogeneous surfaces on the substrate are employed to direct deposition of the functionalized PAH molecule to surface sites interstitial to the array of vias. Vias may be backfilled with conductive material as self-aligned source/drain contacts. Directed self-assembly techniques may be employed to form local interconnect lines coupled to the conductive via material. In some embodiments, graphene-based interconnects comprising a linear array of PAH molecules are formed over a substrate.


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