The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Dec. 30, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kyle Yazzie, Chandler, AZ (US);
Mohit Mamodia, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/06 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01);
Abstract
An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component. Other embodiments are also disclosed and claimed.