The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Sep. 17, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ilya Lavitsky, San Francisco, CA (US);

Keith A. Miller, Mountain View, CA (US);

John Mazzocco, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/54 (2006.01); C23C 14/56 (2006.01); C23C 14/35 (2006.01); C23C 14/50 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32513 (2013.01); C23C 14/34 (2013.01); C23C 14/351 (2013.01); C23C 14/50 (2013.01); C23C 14/54 (2013.01); C23C 14/564 (2013.01); H01J 37/32449 (2013.01); H01J 37/32651 (2013.01); H01J 37/32834 (2013.01);
Abstract

Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.


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