The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Mar. 06, 2019
Applicant:

Acer Incorporated, New Taipei, TW;

Inventors:

Cheng-Yu Cheng, New Taipei, TW;

Wen-Neng Liao, New Taipei, TW;

Cheng-Wen Hsieh, New Taipei, TW;

Assignee:

Acer Incorporated, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28F 13/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 13/02 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20409 (2013.01);
Abstract

A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.


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