The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jun. 17, 2016
Applicant:
Eternal Materials Co., Ltd., Kaohsiung, TW;
Inventors:
Shun-Jen Chiang, Kaohsiung, TW;
Chung-Jen Wu, Kaohsiung, TW;
Po-Yu Huang, Kaohsiung, TW;
Meng-Yen Chou, Kaohsiung, TW;
Chang-Hong Ho, Kaohsiung, TW;
Chun-Kai Cheng, Kaohsiung, TW;
Assignee:
ETERNAL MATERIALS CO., LTD, Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); C09D 179/08 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); B32B 7/12 (2006.01); B32B 27/18 (2006.01); B32B 27/08 (2006.01); B32B 15/20 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1042 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/281 (2013.01); C08G 73/106 (2013.01); C08G 73/1082 (2013.01); C09D 179/08 (2013.01); H05K 1/0353 (2013.01); H05K 3/0097 (2013.01); B32B 2250/40 (2013.01); H05K 3/022 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/1545 (2013.01);
Abstract
The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.