The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Apr. 13, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kun Xu, Sunol, CA (US);

Hassan G. Iravani, Sunnyvale, CA (US);

Denis Ivanov, St. Petersburg, RU;

Boguslaw A. Swedek, Cupertino, CA (US);

Shih-Haur Shen, Sunnyvale, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Benjamin Cherian, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); G06N 3/08 (2006.01); G06N 3/04 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); G06N 3/08 (2013.01); G06N 3/084 (2013.01); H01L 21/30625 (2013.01); G06N 3/0481 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.


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