The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Jan. 08, 2019
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventor:

Alan Weir Bucher, Manheim, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G02B 6/42 (2006.01); H01R 12/71 (2011.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20418 (2013.01); G02B 6/4261 (2013.01); G02B 6/4269 (2013.01); G02B 6/4277 (2013.01); H01R 12/716 (2013.01); H01R 13/665 (2013.01); H01R 13/6658 (2013.01); H05K 7/2039 (2013.01);
Abstract

A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.


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