The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
May. 27, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jung Hak Kim, Daejeon, KR;
Hee Jung Kim, Daejeon, KR;
Se Ra Kim, Daejeon, KR;
Jung Ho Jo, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Seung Hee Nam, Daejeon, KR;
Young Kook Kim, Daejeon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/00 (2013.01); H01L 23/28 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/15311 (2013.01);
Abstract
The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.