The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Mar. 11, 2019
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Gerald Weis, St. Marein im Mürztal, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01P 3/06 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/66 (2013.01); H01L 24/02 (2013.01); H01L 24/16 (2013.01); H01P 3/06 (2013.01); H01L 23/5384 (2013.01); H01L 2223/6622 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/30111 (2013.01); H05K 1/025 (2013.01); H05K 1/183 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10545 (2013.01);
Abstract

Provided is an electronic assembly including (a) an interconnect carrier having an electrically insulating core and at least two electrically conducting layers formed at the electrically insulating core; (b) a first integrated circuit chip mounted at a first side of the interconnect carrier; (c) a second integrated circuit chip mounted at a second side of the interconnect carrier opposite to the first side; and (d) an interconnection structure electrically connecting the first integrated circuit chip with the second integrated circuit chip. The electric interconnection structure extends around the insulating core and includes at least one electric conductor path which is designed in such a manner that an impedance match between the first integrated circuit chip and the second integrated circuit chip is provided. Further, there is provided an electronic system comprising such an electronic assembly.


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