The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Jun. 24, 2019
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Yoko Nakabayashi, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/15 (2013.01); H01L 23/49866 (2013.01); H01L 24/16 (2013.01); H01L 23/3157 (2013.01); H01L 2224/16227 (2013.01);
Abstract
A wiring substrate includes: a substrate; an oxide film including an oxide of one or both of Ti and Zr, the oxide film being formed on a surface of the substrate; an alloy film including an alloy of one or any combination of Ni, Co, and W with Cu, the alloy film being formed on the oxide film; and a Cu layer formed on the alloy film.
Nakabayashi, Yoko. (2021). Wiring substrate (U.S. Patent No. 10991645). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10991645
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile