The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

May. 29, 2019
Applicant:

Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);

Inventor:

Jason F. Ross, Haymarket, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/00 (2006.01); G06F 11/10 (2006.01); G11C 11/56 (2006.01); G06F 1/3287 (2019.01); G11C 11/16 (2006.01); G06F 1/3206 (2019.01);
U.S. Cl.
CPC ...
G06F 11/1016 (2013.01); G06F 1/3206 (2013.01); G06F 1/3287 (2013.01); G06F 11/1068 (2013.01); G11C 11/1655 (2013.01); G11C 11/1657 (2013.01); G11C 11/5628 (2013.01);
Abstract

A disclosed apparatus and method reduce the likelihood of multiple bit single event upset (SEU) errors in space-deployed memory devices and memory macros. For each memory, a bit selection layer effectively increases the mux of the memory bit table, thereby reducing the word size while increasing the word capacity, without changing the total memory capacity. As a result, the separation between the physical bit storage locations for each word is increased, thereby reducing the likelihood of multiple bit SEU errors. A buffer can be implemented if the memory lacks individual bit write control. The memory can be implemented in a core integrated circuit (IC) of an multi-chip module (MCM) hybrid integrated circuit (HIC), and the bit selection layer and/or buffer can be implemented in a chiplet or chiplets of the MCM-HIC.


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