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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10989846 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Jun. 14, 2018

Near infrared absorbing composition, near infrared cut filter, method of manufacturing near infrared cut filter, solid image pickup element, camera module, and image display device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Seiichi Hitomi, Haibara-gun, JP;

Takashi Kawashima, Haibara-gun, JP;

Keisuke Arimura, Haibara-gun, JP;

Takahiro Okawara, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Monique R Peets

Int. Cl.
CPC ...
C08K 5/29 (2006.01); G02B 5/22 (2006.01); C08L 33/10 (2006.01); C08L 43/04 (2006.01); C08L 101/02 (2006.01); C08K 5/00 (2006.01); C08L 101/10 (2006.01); C08K 5/52 (2006.01); H01L 27/146 (2006.01); G02B 5/20 (2006.01); C08L 101/12 (2006.01); C08K 5/3437 (2006.01); G02B 5/00 (2006.01); H01L 27/14 (2006.01); C08K 5/3417 (2006.01); C08K 5/16 (2006.01); C08K 5/01 (2006.01); C08K 5/54 (2006.01); G02B 5/28 (2006.01);
U.S. Cl.
CPC ...
G02B 5/22 (2013.01); C08K 5/00 (2013.01); C08K 5/0091 (2013.01); C08K 5/01 (2013.01); C08K 5/16 (2013.01); C08K 5/29 (2013.01); C08K 5/3417 (2013.01); C08K 5/3437 (2013.01); C08K 5/5205 (2013.01); C08K 5/54 (2013.01); C08L 33/10 (2013.01); C08L 43/04 (2013.01); C08L 101/02 (2013.01); C08L 101/025 (2013.01); C08L 101/10 (2013.01); C08L 101/12 (2013.01); G02B 5/003 (2013.01); G02B 5/208 (2013.01); G02B 5/223 (2013.01); G02B 5/281 (2013.01); H01L 27/14 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01);
Abstract

Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A.

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