The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
May. 08, 2018
Applicant:
Macdermid Enthone Inc., Waterbury, CT (US);
Inventors:
Roger Bernards, South Haven, MN (US);
James Martin, Eden Prairie, MN (US);
Jason J. Carver, Carver, MN (US);
Assignee:
MacDermid Enthone Inc., Waterbury, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/54 (2006.01); C25D 5/56 (2006.01); C23C 28/00 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/423 (2013.01); C25D 5/54 (2013.01); H05K 3/002 (2013.01); H05K 3/381 (2013.01); H05K 3/425 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0763 (2013.01);
Abstract
A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.