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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10985149 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Jan. 15, 2019

Semiconductor device package and method of manufacturing the same

Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Chien Chan Yeh, Changhua County, TW;

Ying-Chih Kuo, Hsinchu, TW;

Wei-Feng Lin, Hsinchu County, TW;

Assignee:

Omnivision Technologies, Inc, Santa Clara, CA (US);

Attorney:

Muncy, Geissler. Olds & Lowe, P.C.

Primary Examiner:

Zandra V Smith

Assistant Examiner:

John M Parker

Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3171 (2013.01); H01L 23/5384 (2013.01); H01L 24/17 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01);
Abstract

A semiconductor device package includes a transparent substrate, a photo detector and a first conductive layer. The transparent substrate has a first surface and a first cavity underneath the first surface. The photo detector is disposed within the first cavity. The photo detector has a sensing area facing toward a bottom surface of the first cavity of the transparent substrate. The first conductive layer is disposed over the transparent substrate and electrically connected to the photo detector.

Find Patent Forward Citations

Yeh, Chien. (2021). Semiconductor device package and method of manufacturing the same (U.S. Patent No. 10985149). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10985149

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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