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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10985132 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Jul. 14, 2020

Bonding apparatus, bonding system, bonding method and storage medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yoshitaka Otsuka, Koshi, JP;

Takashi Nakamitsu, Koshi, JP;

Yosuke Omori, Koshi, JP;

Kenji Sugakawa, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Joshel Rivera

Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 23/00 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); B32B 15/01 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); H01L 21/68 (2006.01); B32B 37/10 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B32B 15/01 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67742 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); B32B 37/0046 (2013.01); B32B 37/10 (2013.01); B32B 41/00 (2013.01); B32B 2041/04 (2013.01); B32B 2457/14 (2013.01); H01L 2224/753 (2013.01); H01L 2224/7515 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75302 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/75986 (2013.01); H01L 2224/80009 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80908 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83908 (2013.01);
Abstract

There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

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