The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Jan. 24, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Atsushi Kurokawa, Kyoto, JP;

Masayuki Aoike, Kyoto, JP;

Takayuki Tsutsui, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/088 (2006.01); H01L 29/165 (2006.01); H01L 29/205 (2006.01); H01L 29/737 (2006.01); H01L 27/082 (2006.01); H01L 21/8234 (2006.01); H01L 21/8222 (2006.01); H03F 3/213 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/8222 (2013.01); H01L 21/823475 (2013.01); H01L 27/088 (2013.01); H01L 27/0823 (2013.01); H01L 29/165 (2013.01); H01L 29/205 (2013.01); H01L 29/7371 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/351 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 2200/222 (2013.01); H03F 2200/267 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

A first wiring is disposed above operating regions of plural unit transistors formed on a substrate. A second wiring is disposed above the substrate. An insulating film is disposed on the first and second wirings. First and second cavities are formed in the insulating film. As viewed from above, the first and second cavities entirely overlap with the first and second wirings, respectively. A first bump is disposed on the insulating film and is electrically connected to the first wiring via the first cavity. A second bump is disposed on the insulating film and is electrically connected to the second wiring via the second cavity. As viewed from above, at least one of the plural operating regions is disposed within the first bump and is at least partially disposed outside the first cavity. The planar configuration of the first cavity and that of the second cavity are substantially identical.


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