The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Jul. 24, 2019
Applicant:

Veeco Instruments Inc., Plainview, NY (US);

Inventors:

Ajit P. Paranjpe, Basking Ridge, NJ (US);

Christopher J. Morath, Basking Ridge, NJ (US);

Assignee:

Veeco Instruments Inc., Plainview, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); B32B 37/00 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/12 (2013.01); B32B 37/025 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); B32B 2457/20 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Transfer methods disclosed herein include transferring micro-LEDs from a first carrier to a second carrier. The methods include bonding the micro-LEDs to the first carrier using a first releasable bonding layer that releases when exposed to actinic light. The micro-LEDs are then secured to a second carrier. The first bonding layer is then irradiated through the first releasable bonding layer through the first carrier with the actinic light to release the micro-LEDs from the first carrier. The second carrier can be a display backplane having bonding pads and the micro-LEDs can be secured to the bonding pads.


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