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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10984990 B1

PDFFull Text
Expired
Date of Patent:
Apr. 20, 2021

Filed:

Apr. 17, 2018

Electrode assembly

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ramesh Bokka, Milpitas, CA (US);

Jason M. Schaller, Austin, TX (US);

Jay D. Pinson, II, San Jose, CA (US);

Luke Bonecutter, Cedar Park, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Jethro M Pence

Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/458 (2006.01); C23C 16/50 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); C23C 16/503 (2006.01); C23C 16/517 (2006.01); C23C 16/509 (2006.01); C23C 16/46 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); C23C 16/4586 (2013.01); C23C 16/463 (2013.01); C23C 16/50 (2013.01); C23C 16/503 (2013.01); C23C 16/509 (2013.01); C23C 16/517 (2013.01); H01J 37/321 (2013.01); H01J 37/3244 (2013.01); H01J 37/32743 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01); H01L 21/67069 (2013.01);
Abstract

A plasma processing apparatus is provided including a radio frequency power source; a direct current power source; a chamber enclosing a process volume; and a substrate support assembly disposed in the process volume. The substrate support assembly includes a substrate support having a substrate supporting surface; an electrode disposed in the substrate support; and an interconnect assembly coupling the radio frequency power source and the direct current power source with the electrode.

Find Patent Forward Citations

Bokka, Ramesh. (2021). Electrode assembly (U.S. Patent No. 10984990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10984990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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