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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10982093 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Feb. 08, 2016

Low-dielectric resin composition

Applicant:

Arisawa Mfg. Co., Ltd., Niigata, JP;

Inventors:

Kazuo Yoshikawa, Niigata, JP;

Makoto Tai, Niigata, JP;

Nobuyuki Iwano, Niigata, JP;

Assignee:

Arisawa Mfg. Co., Ltd., Niigata, JP;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
C08L 75/04 (2006.01); B32B 27/20 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); H05K 1/03 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
C08L 75/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); H05K 1/0373 (2013.01); B32B 2307/204 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/05 (2013.01);
Abstract

The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

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