The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Mar. 02, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kai-Fung Chang, Taipei, TW;

Len-Yi Leu, Hsinchu, TW;

Lien-Yao Tsai, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B61C 1/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); H01L 23/48 (2006.01); G01L 9/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0021 (2013.01); B81B 7/02 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/09 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0172 (2013.01); G01L 9/0042 (2013.01); G01L 9/0073 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81805 (2013.01);
Abstract

A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.


Find Patent Forward Citations

Loading…