The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
May. 18, 2015
Mitsubishi Materials Corporation, Tokyo, JP;
Ji-bin Yang, Kitamoto, JP;
Koichi Kita, Kitamoto, JP;
Toshihiko Saiwai, Kitamoto, JP;
Koji Hoshino, Kitamoto, JP;
Jun Katoh, Kitamoto, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact () that includes aluminum substrates () sintered to each other. The junction (), in which the aluminum substrates () are bonded to each other, includes the Ti—Al compound () and the Mg oxide (). It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates (), and the pillar-shaped protrusions include the junction ().