The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 24, 2020
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Min-Hsun Hsieh, Hsinchu, TW;

Tzer-Perng Chen, Hsinchu, TW;

Jen-Chau Wu, Hsinchu, TW;

Yuh-Ren Shieh, Hsinchu, TW;

Chuan-Cheng Tu, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/38 (2010.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 24/73 (2013.01); H01L 33/0093 (2020.05); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 27/153 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/504 (2013.01); H01L 33/505 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83851 (2013.01); H01L 2933/0033 (2013.01);
Abstract

The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.


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