The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Oct. 17, 2019
Applicants:

Taiwan Semiconductor Manufacturing Company, Ltd, Hsinchu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Jenn-Gwo Hwu, Taipei, TW;

Wei-Cheng Tian, Taipei, TW;

Samuel C. Pan, Hsinchu, TW;

Chao-Hsiung Wang, Hsinchu, TW;

Chi-Wen Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/112 (2006.01); H01L 23/525 (2006.01); C25D 11/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 29/775 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11206 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); C25D 11/02 (2013.01); H01L 21/02258 (2013.01); H01L 21/76838 (2013.01); H01L 21/76888 (2013.01); H01L 23/5252 (2013.01); H01L 29/0673 (2013.01); H01L 29/401 (2013.01); H01L 29/42364 (2013.01); H01L 29/42372 (2013.01); H01L 29/42392 (2013.01); H01L 29/775 (2013.01); H01L 2221/1094 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for forming an antifuse on a substrate is provided, which comprises: forming a first conductive material on the substrate; placing the first conductive material in an electrolytic solution; performing anodic oxidation on the first conductive material to form a nanowire made of the first conductive material and surrounded by a first dielectric material formed during the anodic oxidation and to form the antifuse on the nanowire; and forming a second conductive material on the antifuse to sandwich the antifuse between the first conductive material and the second conductive material.


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