The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Feb. 27, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jongbo Shim, Asan-si, KR;
Ji Hwang Kim, Cheonan-si, KR;
Chajea Jo, Yongin-si, KR;
Sang-Uk Han, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a lower substrate, a connection substrate coupled to the lower substrate, the connection substrate having a lateral portion surrounding a cavity, and a first conductive pattern on a top surface of the lateral portion, a lower semiconductor chip on the lower substrate, the lower semiconductor chip being in the cavity of the connection substrate, and the lower semiconductor chip including a second conductive pattern on a top surface of the lower semiconductor chip, a bonding member connecting the first conductive pattern and the second conductive pattern to each other, and a top package on the first conductive pattern and the second conductive pattern.