The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Apr. 15, 2019
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Stmicroelectronics SA, Montrouge, FR;

Inventors:

Didier Dutartre, Meylan, FR;

Jean-Pierre Carrere, Grenoble, FR;

Jean-Luc Huguenin, Grenoble, FR;

Clement Pribat, Villard Bonnot, FR;

Sarah Kuster, Grenoble, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/146 (2006.01); H01L 27/06 (2006.01); H01L 27/07 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 21/84 (2006.01); H01L 21/762 (2006.01); H01L 21/74 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/743 (2013.01); H01L 21/7624 (2013.01); H01L 21/823475 (2013.01); H01L 21/84 (2013.01); H01L 27/1207 (2013.01); H01L 29/0649 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01);
Abstract

A silicon on insulator substrate includes a semiconductor bulk handle wafer, an insulating layer on said semiconductor bulk handle wafer and a semiconductor film on said insulating layer. An opening extends completely through the semiconductor film and insulating layer to expose a surface of the semiconductor bulk handle wafer. Epitaxial material fills the opening and extends on said semiconductor film, with the epitaxial material and semiconductor film forming a thick semiconductor film. A trench isolation surrounds a region of the thick semiconductor film to define an electrical contact made to the semiconductor bulk handle wafer through the opening.


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