The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
May. 03, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01L 25/18 (2006.01); H01L 25/04 (2014.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/56 (2013.01); H01L 23/49517 (2013.01); H01L 23/49575 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 25/04 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01);
Abstract
At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a carrier having a first surface and a second surface opposite to the first surface, an encapsulant, and an antenna. The encapsulant is disposed on the first surface of the carrier. The antenna is disposed on the encapsulant. The antenna includes a seed layer and a conductive layer.