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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10976491 B1

PDFFull Text
Date of Patent:
Apr. 13, 2021

Filed:

Oct. 27, 2017

Photonics interposer optoelectronics

Applicants:

The Research Foundation for the State University of New York, Albany, NY (US);

The Trustees of Columbia University IN the City of New York, New York, NY (US);

Analog Photonics, Llc, Boston, MA (US);

Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US);

Inventors:

Douglas Coolbaugh, Albany, NY (US);

Michael Watts, Boston, MA (US);

Michal Lipson, New York, NY (US);

Keren Bergman, New York, NY (US);

Thomas Koch, Tucson, AZ (US);

Jeremiah Hebding, Albany, NY (US);

Daniel Pascual, Albany, NY (US);

Douglas La Tulipe, Albany, NY (US);

Assignees:

THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK, Albany, NY (US);

THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK, New York, NY (US);

ANALOG PHOTONICS, LLC, Boston, MA (US);

ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA, Tucson, AZ (US);

Attorneys:

George S. Blasiak

Heslin Rothenberg Farley & Mesiti PC

Primary Examiner:

Ryan A Lepisto

Assistant Examiner:

Erin D Chiem

Int. Cl.
CPC ...
G02B 6/122 (2006.01); G02B 6/136 (2006.01); G02B 6/132 (2006.01); H01L 23/498 (2006.01); H01S 5/22 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); G02B 6/42 (2006.01); G02B 6/30 (2006.01); G02B 6/43 (2006.01); H01S 5/022 (2021.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/122 (2013.01); G02B 6/132 (2013.01); G02B 6/136 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01S 5/02248 (2013.01); H01S 5/02284 (2013.01); G02B 6/30 (2013.01); G02B 6/428 (2013.01); G02B 6/4245 (2013.01); G02B 6/43 (2013.01); G02B 2006/12061 (2013.01); H01S 5/02236 (2013.01); H01S 5/02276 (2013.01);
Abstract

In one embodiment an optoelectronic system can include a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying signals to different areas of the functional interposer structure. The system can further include one or more photonics device integrally formed in the functional interposer structure, and one or more prefabricated component attached to the functional interposer structure.

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