The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

May. 04, 2017
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Christian Wendeln, Berlin, DE;

Lutz Stamp, Berlin, DE;

Bexy Dosse, Berlin, DE;

Kay Wurdinger, Berlin, DE;

Gerson Krilles, Berlin, DE;

Tang Cam Lai Nguyen, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/40 (2006.01); C23C 18/18 (2006.01); C23C 18/30 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 18/16 (2006.01); B05D 5/12 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
C23C 18/40 (2013.01); C23C 18/1844 (2013.01); C23C 18/2066 (2013.01); C23C 18/30 (2013.01); B05D 5/12 (2013.01); B05D 2350/00 (2013.01); C23C 18/1692 (2013.01); C23C 18/1893 (2013.01); C23C 18/24 (2013.01); H05K 3/1208 (2013.01);
Abstract

A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.


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