The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Aug. 06, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Jeng-Nan Hung, Taichung, TW;
Chun-Hui Yu, Hsinchu County, TW;
Kuo-Chung Yee, Taoyuan County, TW;
Yi-Da Tsai, Chiayi Country, TW;
Wei-Hung Lin, Hsinchu County, TW;
Ming-Da Cheng, Taoyuan, TW;
Ching-Hua Hsieh, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes a plurality of first dies spaced from each other, a molding layer between the first dies, a second die over the plurality of first dies and the molding layer, and an adhesive layer between the plurality of first dies and the second die, and between the molding layer and the second die. A first interface between the adhesive layer and the molding layer and a second interface between the adhesive layer and the plurality of first dies are at different levels.