The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
May. 01, 2019
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Aniket Patil, San Diego, CA (US);
Kuiwon Kang, San Diego, CA (US);
Zhijie Wang, San Diego, CA (US);
Ming Yi, Sunnyvale, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/04 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 21/52 (2006.01); H01L 23/556 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/49822 (2013.01); H01L 23/556 (2013.01);
Abstract
Certain aspects of the present disclosure provide an integrated circuit (IC) package and techniques for fabricating the IC package. The IC package generally includes a substrate, an IC disposed above the substrate, and a shielding layer coupled to a layer of the substrate, wherein the shielding layer is disposed above the substrate adjacent to the IC, and below an upper surface of the IC.