The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jul. 27, 2017
Applicant:

Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;

Inventors:

Yuying Gao, Shanghai, CN;

Wei Wei, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/67 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B32B 43/006 (2013.01); B32B 38/10 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/19 (2015.01); Y10T 156/1983 (2015.01);
Abstract

A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate () and a second fixation plate (), respectively. The device includes: a mounting plate (), disposed at an outer side of one of the first () and second () fixation plates; a connecting rod assembly () fixed around a center position of the mounting plate (), the connecting rod assembly () connected to the one of the first () and second () fixation plates sequentially via a sliding pair () and a spherical pair () connected to the sliding pair (); and at least three elastic assemblies () disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate () and the one of the first () and second () fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.


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