The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Sep. 16, 2016
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Teruhisa Matsumaru, Kanagawa, JP;

Shuya Suenaga, Kanagawa, JP;

Yohei Abiko, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/14 (2006.01); B32B 27/28 (2006.01); C08G 73/16 (2006.01); C08G 73/10 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
C08G 73/16 (2013.01); B32B 27/06 (2013.01); B32B 27/281 (2013.01); C08G 73/1042 (2013.01); C08G 73/14 (2013.01); B32B 2250/02 (2013.01); B32B 2307/412 (2013.01); B32B 2379/08 (2013.01); B32B 2457/14 (2013.01); B32B 2457/20 (2013.01); B32B 2551/00 (2013.01);
Abstract

Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 μm. Rand Rin the formula (1-1) each independently represent any group of the following formulae (i) to (iv), Rand Rin the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.


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