The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Aug. 16, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chun-Wen Cheng, Zhubei, TW;

Chia-Hua Chu, Zhubei, TW;

Wen Cheng Kuo, Changhua County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0021 (2013.01); B81B 7/0029 (2013.01); B81C 1/0023 (2013.01); B81C 1/00325 (2013.01); B81C 1/00357 (2013.01); B81C 1/00476 (2013.01); B81C 1/00539 (2013.01); B81C 1/00825 (2013.01); B81C 3/001 (2013.01); B81B 7/0006 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/115 (2013.01); H01L 23/053 (2013.01); H01L 24/48 (2013.01); H01L 2224/48195 (2013.01);
Abstract

Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.


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