The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Mar. 30, 2018
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01);
Abstract
A solder alloy having an alloy composition consisting of, in mass %, Ag: 1% to 4%, Cu: 0.5% to 0.8%, Bi: more than 4.8% and 5.5% or less. Sb: more than 1.5% and 5.5% or less, Ni: 0.01% or more and less than 0.1%, Co: more than 0.001% and 0.1% or less, the balance being Sn. The alloy composition satisfies the following three relationships: 0.020%≤Ni+Co≤0.105%; 9.1%≤Sb+Bi≤10.4%; and 4.05×10≤(Ni+Co)/(Bi+Sb)≤1.00×10, where Ni, Co, Bi, and Sb each represent a content (mass %) thereof in the solder alloy.