The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jan. 30, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventor:

Chien-Huei Chen, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/88 (2006.01); G03F 7/20 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/8851 (2013.01); G01N 21/956 (2013.01); G03F 7/7065 (2013.01); G01N 2021/8887 (2013.01); G01N 2021/95676 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A defect detecting method, a defect detecting system, and a non-transitory computer-readable medium are provided. The defect detecting method includes applying a rank filter to multiple scan images of consecutive dies of a reference wafer scanned by a wafer inspection tool to obtain multiple reference die images; collecting multiple target die images of a target die of a target wafer scanned by the wafer inspection tool; comparing the target die images with the reference die images to detect multiple defects according to differences of pixel values of corresponding pixels in the target die images and the reference die images; and excluding multiple common defects from the detected defects to detect at least one mask defect printed on the target wafer, where the common defects are obtained by the wafer inspection tool performing a wafer inspection on the target wafer.


Find Patent Forward Citations

Loading…