The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Feb. 07, 2017
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Michio Murata, Nirasaki, JP;
Tatsuo Kawashima, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06766 (2013.01); G01R 1/0433 (2013.01); G01R 1/07314 (2013.01); G01R 31/28 (2013.01);
Abstract
There is provided a substrate inspection apparatus capable of inspecting the electrical characteristics of a packaged semiconductor device in a mounting environment. A prober includes a test box, a probe card and a package inspection card. A packaged device is attached to the package inspection card. A test board of the test box and a card board of the package inspection card reproduce the mounting environment in which a wafer-level system-level test is performed.