The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Jun. 20, 2019
Nexperia B.v., Nijmegen, NL;
Ricardo Lagmay Yandoc, Nijmegen, NL;
Adam Richard Brown, Nijmegen, NL;
Arnel Biando Taduran, Nijmegen, NL;
Nexperia B.V., Nijmegen, NL;
Abstract
The disclosure relates to a lead frame assembly for a semiconductor device, the lead frame assembly including: a die attach structure and clip frame structure. The clip frame structure includes: a die connection portion configured to contact to one or more contact terminals on a top side of the semiconductor die; one or more electrical leads extending from the die connection portion at a first end, and a lead supporting member extending from a second end of the one or more leads; and a plurality of clip support members arranged orthogonally to the one or more electrical leads. The plurality of support members and the lead supporting member are configured to contact the die attach structure. The present disclosure also relates a die attach structure and clip frame structure for a semiconductor device, a semiconductor device including the same and a method of manufacturing the semiconductor device.