The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Jun. 07, 2019
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tomotake Minemura, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 35/30 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32724 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 35/30 (2013.01); H01J 2237/002 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01);
Abstract

An electrostatic chuck includes a base having a support surface configured to retain a retaining target by electrostatic retention, and a thermocouple configured to detect a temperature of the base. The thermocouple includes first and second metal parts provided inside the base and having ends connected to each other to form a measuring junction, a first wire part having one end connected to the other end of the first metal part inside the base, and another end extending outside the base, and a second wire part having one end connected to the other end of the second metal part inside the base, and another end extending outside the base. The first metal part and the first wire part are formed from a first material, and the second metal part and the second wire part are formed from a second material different from the first material.


Find Patent Forward Citations

Minemura, Tomotake. (2021). Electrostatic chuck and substrate fixing apparatus (U.S. Patent No. 10957574). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10957574

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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