The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

May. 10, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yutaka Motoyama, Nirasaki, JP;

Younggi Hong, Gyeonggi-do, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/762 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); C23C 16/24 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01); H01L 21/768 (2006.01); H01L 21/76 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); C23C 16/24 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); H01L 21/02532 (2013.01); H01L 21/3065 (2013.01);
Abstract

There is provided a method of forming a semiconductor film, including: a first process of supplying a first semiconductor raw material gas onto a substrate having recesses formed therein to form a first semiconductor film in each of the recesses, each of the recesses being covered with an insulating film; a second process of supplying a halogen-containing etching gas onto the substrate to etch the first semiconductor film while exposing a surface of the insulating film in an upper portion of an inner wall of each of the recesses and leaving the first semiconductor film formed on a bottom surface of each of the recesses; and a third process of simultaneously supplying a halogen-containing semiconductor gas and a semiconductor hydride gas onto the substrate to form a second semiconductor film on the first semiconductor film formed on the bottom surface of each of the recesses.


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