The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Mar. 15, 2019
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Soren Konecky, Alameda, CA (US);

Bjorn Brauer, Beaverton, OR (US);

Assignee:

KLA Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06T 7/62 (2017.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/9501 (2013.01); G06T 7/62 (2017.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A semiconductor die is inspected using an optical microscope to generate a test image of the semiconductor die. A difference image between the test image of the semiconductor die and a reference image is derived. For each defect of a plurality of defects for the semiconductor die, a point-spread function is fit to the defect as indicated in the difference image and one or more dimensions of the fitted point-spread function are determined. Potential defects of interest in the plurality of defects are distinguished from nuisance defects, based at least in part on the one or more dimensions of the fitted point-spread function for respective defects of the plurality of defects.


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