The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Sep. 14, 2018
Applicant:

Teradyne, Inc., North Reading, MA (US);

Inventors:

Anthony J. Suto, Sterling, MA (US);

John Joseph Arena, Reading, MA (US);

Joseph Francis Wrinn, Winchester, MA (US);

Assignee:

Teradyne, Inc., North Reading, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/00 (2006.01); G01R 27/26 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2853 (2013.01); G01R 27/2605 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/30105 (2013.01);
Abstract

Disclosed herein are testing apparatus and methods to identify latent defects in IC devices based on capacitive coupling between bond wires. Bond wires may have latent defects that do not appear as hard shorts or hard opens at the time of testing, but may pose a high risk of developing into hard shorts or hard opens over time. A latent defect may form when two adjacent bond wires are disturbed to become close to each other. According to some embodiments, capacitive coupling between a pair of pins may be used to provide an indication of a near-short latent defect between bond wires connected to the pair of pins.


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