The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Feb. 22, 2019
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Tyco Electronics (Dongguan) Ltd., Dongguan, CN;
Te Connectivity Corporation, Berwyn, PA (US);
Lei Zhou, Shanghai, CN;
Dandan Zhang, Shanghai, CN;
Roberto Francisco-Yi Lu, Shanghai, CN;
Hongzhou Shen, Shanghai, CN;
Jian Zeng, Shanghai, CN;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Tyco Electronics (Dongguan) Ltd., Dongguan, CN;
TE Connectivity Corporation, Berwyn, PA (US);
Abstract
A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.